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Bondjet BJ920
The Bondjet BJ920 is a nex development in heavy wire bonding. Hesse & Knipps has designed a bonder available with integrated pull and shear test, a high speed and accuracy and largest bonding area which is presently unique in the market. Advanced features available only on Bondjet BJ920 and enhanced quality control systems serve to meet your customers' requirements and greatly enhance productivity.
Advanced Features:
- E-Box: patent-pending solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
- Quality monitoring by high resolution deformation and transducer current measurement
- Program upload and download via LAN
- Flexible multi-lane handlers
Integrated Non-destructive Shear and / or Pull Test:
- Fast shear test with less stress for the connection than pull test
- Programmable pull test for each wire
Speed:
- 450 ms per wire (300 μm diameter, 8 mm loop length, 4 mm loop height)
Accuracy:
- 10 μm at 3 σ repeatibility at each position in the large work area
- 7 μm pattern recognition system accuracy
Largest Bonding Area:
- Up to 380 mm x 500 mm (15'' x 19.7'')
Bondhead Highlights:
- Maintenance-free solid state joints
- Active cutting bondhead with extended cutter lifetime
- No pusher provides better access into tight packages
- Closed loop force control, programmable from 0 to 1400 cN
- Touchdown and deformation sensor without signal delay
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FC150: The Most Flexible High Accuracy Die Bonder
With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production.
Available as a fully automated system to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding.
Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.
The FC150 accommodates a wide variety of processes and materials, including extremely fragile materials such as GaAs and HgCdTe. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Bond process changes are easily achieved.
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Panasonic's DMX is a world-class, high-productivity die bonder supporting 200mm and 300mm wafers. The eight-nozzle head system offers unparalleled productivity, providing results that are nearly 300% greater than conventional die bonders. The 3-beam mechanism and multi-nozzle bond head provide substrate recognition and both pre- and post-bond inspection.
The high-speed and volumetric epoxy writing system provide for increased productivity of up to 8,000 UPH (actual cycle). Seven (7) standard patterns are installed with free pattern programmability. Multi-beam parallel processing supports wafer (die) recognition, multi-nozzle bonding and substrate recognition (pre- and postbond inspection).
Features & Benefits
Flexible for ultra thin die, Semi S2/S8 option
Near zero transport time for increased machine utilization
Wafer mapping software capability
High speed positive displacement dispensing
Accurate to +/- 25 microns, die size: 0.25mm to 25.4mm
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Model 616A Peg Bonders are used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine. Bare wire diameters equal to or smaller than 75um, insulated wires up to 51um and flat conductors up to 25um x 500um can be bonded with the 616A.
The 616A has a series of seven different configurations that allow it to fit into existing production lines, single work benches or new production lines.
For more information, please contact us at mailus@hybond.com.
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The 626 can be a Wedge bonder (wedge-wedge), Ball bonder (ball-wedge), Peg bonder (for tacking down pre-aligned leads, ribbons and bare or insulated wires) and a Bump bonder (gold stud bumping) without having to remove or replace any electrical or mechanical machine component. Conversion time from Ball bonder to Wedge bonder or vice versa is the same as the time spent replacing a used tool with a new one.
With servomotor control, touch sensor and linear vertical movement, the 626 bond head can move and bond within a 0.750” vertical range without the need to readjust the work stage or bonder platform height. The 626 also has LCD display with parameters in actual units, storage in memory for up to 75 different schedules (or “recipes”) and independent 1st and 2nd bond digital parameter settings. All these features and yet it’s smaller, weighs less and is more cost effective than most other wire bonders.
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Hybond designs, manufactures and sells ultrasonic and thermosonic wire bonders. Products include:
Ball Bonders: for ball bonding and bump bonding of gold wire.
Wedge Bonders: for bonding of gold, aluminum, platinum, copper and other material wires and ribbon (flat wire).
Peg Bonders: Used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine.
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Bondjet BJ820
The Bondjet BJ820 is the latest development of Hesse & Knipps' wedge bonding innovation, handling all challenging wire bonding applications on a single platform - RF and microwave devices, COB, MCM and hybrids, fiberoptics and automotive using aluminium or gold wire or ribbon.
High Speed Fine Pitch Wedge Bonder
Precision:
- 1 μm at 3 σ axis repeatibility at an interpolated encoder resolution of 20 nm
Largest Bonding Area
- 305 mm x 410 mm (12'' x 16,1'') work area can serve as two or mor smaller stations for efficient handling of smaller products or substrates, eliminating index time and maximizing throughput
- Enables intelligent automation of extra large products
Speed:
- Up to 7 wires per second
Quality:
- Consistant performance for the highest yields
- Realtime bond quality monitoring system
- Wear- and maintenance free piezo bondhead with solid state hinges
- Software supports control by host computer, product traceability and external statistical analysis
Small footprint, big capability:
- Integrates easily into complex production lines
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Model 522A is a Thermosonic Ball Bonder for wires from 0.7mil (18µm) to 2.0mil (50µm) in diameter featuring HYBOND’s exclusive Soft Touch TM force ramping system. Imitated but never duplicated, the Soft Touch™ system bonds effectively with less trauma to sensitive materials like GaAs and InP. Wire control is provided by a motorized feed system which features front panel adjustment for tail length and a swing away clamp assembly which makes threading wire easier. Front panel controls include independent 1st and 2nd bond dials for U/S, Time & Force as well as a built in work stage temperature controller. The 522A has a proven track record of safe and effective wire bonding worldwide.
Other Ball Bonder models available are the 522A with option 18 (OP-18) for deep access, 522A-40 for deep access and long reach and the 626 with motorized vertical movement and capability to wedge bond, peg bond and bump bond.
Please contact us at mailus@hybond.com for more detailed information.
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Wedge bonders are used in the manufacturing of many microcircuits especially those for RF and microwave applications. Hybond wedge bonders can bond wire and ribbon in materials such as gold, aluminum, copper, silver, palladium and others. For a further look into our wedge bonders we suggest our models 572A, 572A-40, 676 and model 626 multipurpose wire bonder.
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