Diamond soft polishing pad
ø 4" - 10"
3M Electronics
Highly engineered structured abrasive products deliver reliable performance for critical semiconductor CMP applications. 3M™ Diamond Pad Conditioners use deliberate diamond placement and protusion to produce a consistent finish, with superior diamond retention to reduce scratching.
Key features and benefits:
* Lower cost of ownership
* Optimized for extended pad and disk life
* Flat area of active diamonds for low non-uniformity
* Exclusive polymer substrate enhances corrosion resistance
* Diamonds secured with both chemical and mechanical bonds for superior retention
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