Qualcomm’s MDDI standard provides a proven solution for the interconnect challenge between the upper and lower clamshell in a flip phone. The MDDI high-speed solution supports variable data rates of up to 3.2 Gbps. The solution decreases the number of signals that connect the digital baseband controller with the LCD display and camera from as many as 90 to as few as eight pins plus power. This reduction in the interconnect complexity decreases the cost of interconnect, increases reliability and reduces the complexity of handset integration by eliminating multiple synchronous high-speed signals through the hinge in advanced multimedia handsets equipped with high-resolution LCD displays and cameras.
