High-temperature co-fired ceramic (HTCC) microelectronics encapsulation package
Ametek HCC Industries

A high temperature cofired ceramic package (HTCC) is a multilayered, sealed and highly reliable package created using layers of ceramic tape with thicknesses ranging from 5 to 25 millimeters, which are laminated together. The cofired ceramic packages’ tape layers, consisting of 92 percent aluminum oxide ceramic, tungsten and molymanganese, have metallized circuit patterns. Conductive vias pierce the tape layers, forming electrical interconnects between circuits. The ceramic packages’ tape layers are laminated under pressure and the ceramic and metallization are co-sintered at 1600 degrees Celsius, creating a monolithic structure with a three dimensional wiring system.

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