Microelectronic package
Ametek HCC Industries

Hermetically sealed packages are utilized by manufacturers of hybrid microelectronic assemblies, opto-electronic devices and imaging devices to protect their sensitive circuits. HCC Industries packaging companies, HCC Aegis Inc (known in the industry simply as Aegis), Glasseal Products, Inc and General Ceramics are experts in the design and manufacture of glass-to-metal-sealed and high temperature co-fired ceramic packages to meet the demands of these devices. Our experience and expertise includes sealing many different alloys, the effective utilization of thermal management materials (heat sinks) to dissipate heat, complex geometries, tight tolerances and demanding test requirements commonly called out in these industries.

HCC has over 25-years of experience in the design, development and manufacture of micro-electronic hermetic packages and has made thousands of different designs.