Amphenol
Group: AMPHENOL

High density PCB connector
NeXLev® Amphenol

  • high density PCB connector NeXLev® Amphenol
NeXlev® amphenol's nexlev® high-density parallel board
connector is capable of handling data rates up to 12.5 Gbps,
providing a robust solution for your increasing bandwidth
demands in mezzanine applications. the connector can be
routed to support single-ended or differential architectures and
offers 20 stacking heights from 10-33mm. nexlev uniquely
applies bGa attachment technology, widely accepted for its
high reliability, making it robust both during manufacturing
and in the field.



standListOtherProduct www di En 2012-05-21-23