Thermal resistance analyzer
max. 150 °C | QuickLine ™ -50
Anter Corporation
Heat transport across gaps is most frequently improved by the addition of a layer of conductive material that fills the crevices in between, and with that thermally bridges the gap. Heat transfer is then governed by the thermal conductivity of the material, the thickness of the layer, and the two interfaces at the boundaries of the layer. For most engineering applications it is extremely difficult to model this combination from its components, as exact figures for the boundary resistances are usually not known. Further aggravating this is the effect varying surface conditions can bring to the interface. For this reason it is becoming general practice to measure the combination that closely replicates actual use, and determine experimentally the interface impedance of the filler and the two interfaces combined.
- Thermal Interface Materials
- Fast Test Times
- RT to 150°C
- Variable (controlled) Loading
- Easy to use
