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Water soluble thermoplastic adhesive for temporary mounting
Aquabond Aquabond Technologies

Aquabond's water soluble thermoplastic is designed for temporary mounting of hard materials for slicing, dicing, grinding, lapping and polishing. and comes in 3 different bonding temperatures that can be purchased in either stick or bulk form. The nomenclature depicts each product's melting temperature centigrade.

Aquabond 55™ has the lowest melting and bonding temperature and is generally used for lapping, backgrinding, wafer bonding and wafer thinning. It puddles quickly and can spread as thin as four (4) microns.
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