Absolute precision and maximum performance have made the SIPLACE X S the placement platform of choice for demanding high-volume production applications such as network infrastructure (5G), large boards for server and industrial segments. Wherever top speed, lowest dpm rates, non-stop setup changeovers, fast new product introductions and the high-speed placement of the latest generations of super-small components (0201 metric) are needed – the SIPLACE X S delivers.
Highlights of the SIPLACE X S:
• SIPLACE SpeedStar for high-speed and placement of components as small as 0201 (metric) with maximum precision
• SIPLACE Placement Head CPP – the only head that automatically changes modes on demand (C&P, P&P, Mixed Mode)
• SIPLACE TwinStar – the head for special tasks
• Digital SIPLACE vision system for maximum process stability
• Available with two, three and four gantries and smart conveyor options for optimized line configurations
• Modular gantries to meet any production challenges
• SIPLACE Smart Pin Support for automatic placement of PCB support pins