Reflow soldering oven
RPC 1120F
Aurel Automation
Reflow soldering system special design for Thick Film, DCB (Direct Copper Bonding) and IMS (Insulated Metal Substrates)
Mod. RPC 1120F Belt-less conveyor for high temperature and direct heating transmission to the substrates used in:
THICK FILM
DCB (Direct Copper Bonding)
IMS (Insulated Metal Substrates)
Mod. RPC 1120F Belt-less conveyor for high temperature and direct heating transmission to the substrates used in:
THICK FILM
DCB (Direct Copper Bonding)
IMS (Insulated Metal Substrates)
-
zoom








