Ion implanter: low energy, high dose
0.2 - 80 keV | Ultra Axcelis Technologies

The Ultra is a low energy, high dose implanter designed for the most demanding high volume memory and logic manufacturing environments. The Ultra's multi-wafer platform is ideally suited for mass production of ultra shallow junctions and other high dose implants.

- Advanced Low Energy Capability. 200eV to 80keV energy range covers source/drain, source/drain extensions, and emerging poly-doping applications

- Beamline Advantage. Patented electron confinement technology and beamline design overcome the limitations of low energy ion transport -7.0 beamline configuration delivers most beam current in at the lowest energies

- Angle Control. Axcelis multi-wafer endstation is the most accurate and repeatable wafer positioning system available

- Designed for Productivity. Higher beam currents, high-speed parallel wafer handling, and efficient beam utilization means the equipment spends more time doing what customers need; implanting product wafers

- Yield Improvements. Ultra offers a wider range of low energy drift mode performance to avoid energy contamination concerns while Optimized Fast Scan maximizes on-wafer product yield.