Die-attach die bonder Datacon 2200 evo
flip-chipepoxyautomated

die-attach die bonder
die-attach die bonder
die-attach die bonder
die-attach die bonder
die-attach die bonder
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Characteristics

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high-accuracy, flip-chip, epoxy, automated, for die-attach

Description

The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. High Performance at High Accuracy Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request) High productivity, low cost-of-ownership Up to 4 working heads in one machine Multi-Chip Capability Single pass production for complex products Die attach, flip chip, multi-chip in one machine Epoxy writing & stamping, flux dipping Die pick from wafer, waffle pack, gel pack, feeder Die place to carrier, boat, substrate, PCB, lead frame, wafer Hot and cold processes supported: epoxy, soldering, thermo-compression MCM, SiP, Hybrids Open Platform Architecture for Full Customization Most advanced modular platform concept Production line tailored 100% to your needs Ideal solution with smallest footprint possible
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.