Epoxy die bonder Datacon 2200 evo hS

for die-attachhigh-accuracythermal

Innovative Solution for Innovative Products The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Datacon 2200 evo goes hS! - Multi-chip capability - Flexibility for customizing - Open platform architecture Key Features Multi-chip - Fully automatic cycle for Multi-chip production - Up to 7 Pick & Place tools (optionally 14), 5 eject tools - Pressure/time (Musashi®), Auger, Jetter type dispensers available - Epoxy stamping option - Filled and unfilled epoxy, wide viscosity range Accuracy - New high-speed image processing unit - Full alignment & Bad mark search - Pre-defined fiducial geometry & customized teaching Pick & Place Head - Die Attach, Flip Chip and Multi-Chip in one machine - Die pick from: wafer, waffle pack, Gel-Pak®, feeder - Die place to: substrate, boat, carrier, PCB, leadframe, wafer - Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic Specifications Accuracy X/Y placement accuracy: ±7 µm @ 3 sigma Theta placement accuracy: ± 0.15° @ 3s Bond Heads Standard bond head: 0° - 360° rotation Heated bond head: option Dimensions Footprint: 1,160 x 1,225 x 1,800 mm (WxDxH) Weight: 1,450 kg Performance Uptime: > 98% Yield: > 99.95% Output: up to 12,000 UPH