Automated sub-micron die bonder platform
Beijing Torch SMT Co., Ltd.
LED600
Mount head
2 pcs
Max circuit board size
1200*350mm
Max moving range
X axis 1500mm, Y axis 360mm
Max moving range of Z axis
10mm
Typical Mounting speed
5500-6100 cph
Max mount speed
7000cph
Mount accuracy
+/-0.1mm
Position method
Machinery position
Component available
0603and above SMD component and LED
Programme method
Automatic data import/ video study/ keyboard input
Belt feeder
8mm, 12mm, 16mm and 24mm
Feeder num
2 pcs of GF series feeder can be set
Operation system
WINDOWS XP
Compressed air
80 psi(0.5Mpa)
Power supply
220V,50Hz, 3 Kw
Weight
320kg
Dimension
2600*680*1500mm
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