BGA rework station BGA800

BGA rework station
BGA rework station
Add to favorites
Compare this product
 

Characteristics

Applications
for BGA

Description

input voltage AC220V 50/60Hz 10A total power 1100W bottom heating power/ the highest temperature 600W/450 bottom preheating area 200*200MM top heating power/the highest temperature 500W/400 temperature feedback RTD sensor, closed loop controlling max size of chips 70mm×70mm min size of chips 5mm×5mm max size of PCB 400mm×400mm max thickness of PCB 3-6mm Application BGA, CSP, LGA( Land Grid Array), Micro SMD,MLF,BCC Dimension 400×350 ×410mm Weight About 10 KGS

Catalogs

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.