Reflow soldering oven
270 mm x 230 mm | T200N+ Beijing Torch SMT Co., Ltd.

Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200N+ is a fine temperature profile model with temp testing capable of lead-free soldering.
• PC interface software control and visional operation
• Real-time temperature testing function fills the blank of SMT industry overall world for adjusting the temperature at the real time.
• Patented heater installation® for heating evenly
• Patented forced air cycling and ventilating technology® for extremely uniform temperature profiling across the board.
• Patented oven door actuating device® for no vibration after PCB welding.
• Patented auto-open door technology® for higher efficiency on production and the door matched with seal device for keeping temperature.
• Active Ventilation function for exhaust gas emission.
• Exhaust purifying function for environment-friendly.
• Nitrogen inert and N2 saving design.

T200N+ software:
1. Registration
3. temperature curve shown on software
4. Testing temperature curve and record function
Technical Parameter:
Temperature control segment 40 segment,
The segment can be set in computer according to the actual requirement.
Temperature-zone numbers Single-zone and multi-segment
Temperature control system PC control system ,SSR non-contact output
Temperature accuracy ± 2 ºC
Warm-up time 3min
Temperature range Room-temperature -360ºC
Heating supply Infrared ray + Hot air convection
Effective working table area 270mm * 230mm (less than A4)
Welding time 3min ± 1min