The Bergquist Company is the world leader in the development and manufacture of thermally conductive interface materials. Thermal Clad Insulated Metal Substrate (IMS®) was developed by Bergquist as a thermal management solution for today's higher watt-density surface mount applications where die size is reduced and heat issues are a major concern.
Thermal Clad Benefits Include:
Lower operating temperature
Reduce printed circuit board size
Increase power density
Extend the life of dies
Reduce the number of interconnects
Improve product thermal and mechanical performance
Combine power and control
Improve product durability
Enable better use of surface mount technology
Reduce heat sinks and other mounting hardware including thermal interface material
Replace fragile ceramic substrates with greater mechanical durability
