sensor enclosure / small-size / rectangular / PC
BoLink Series Bopla Gehäuse Systeme GmbH

{{requestButtons}}

Characteristics

  • Construction:

    small-size

  • Configuration:

    rectangular

  • Material:

    PC

  • Other characteristics:

    flat design

  • Application:

    electronic equipment, outdoor, for instrumentation, monitoring, indoor, for general purpose, electronics, for printed circuit boards, for sensors

  • Protection level:

    IP65, IP40

Description

The intelligent and versatile enclosure system for modern IoT sensor technology

- 1 basic size
- 3 heights
- 2 colours
- 3 variants (without wall brackets, with wall brackets, with wall brackets and lid fixing on top)
- Design seal optional
- PC material is suitable for outdoor use due to f1-listing according to UL 746C

Other Bopla Gehäuse Systeme GmbH products

Plastic Enclosures