sensor enclosure / small-size / rectangular / PC
BoLink Series Bopla Gehäuse Systeme GmbH



  • Construction:


  • Configuration:


  • Material:


  • Other characteristics:

    flat design

  • Application:

    electronic equipment, outdoor, for instrumentation, monitoring, indoor, for general purpose, electronics, for printed circuit boards, for sensors

  • Protection level:

    IP65, IP40


The intelligent and versatile enclosure system for modern IoT sensor technology

- 1 basic size
- 3 heights
- 2 colours
- 3 variants (without wall brackets, with wall brackets, with wall brackets and lid fixing on top)
- Design seal optional
- PC material is suitable for outdoor use due to f1-listing according to UL 746C

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