MCM technology is applicable to many markets. Substrate technology includes: Thick Professional film ceramic, LTCC, Thin Film and for benign environments, epoxy laminates, such as FR4. For the harshest environments, chip and professional wire MCMs on ceramic are hermetically sealed in metal or ceramic packages. For lower cost applications, epoxy or professional silicone glob top is often used to provide protection of wire bonding or flip-chip assemblies.
