Surface-mount resistor
Caddock Electronics
Style WB - Wire Bond version for hybrid applications with metallized back
surface for solder down heat sinking of the chip, includes bondable termination
pads to receive aluminum wire bonds.
* Thermal resistance is provided to optimize high power designs when utilizing
higher thermal conductivity circuit board substrates such as IMS or Alumina.
* Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,
and 0.10 ohm at ±1%.
* Low inductance provides excellent high frequency and pulse response.
* High pulse handling and overload capability.
* Best choice for switching power supplies, motor speed controls, and high
current sensing applications.
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