The Shallow Probe model LEXFAB-300 is a turnkey system designed to meet the needs for fully automated semiconductor fab application and currently used for the 90nm, 65nm and 45nm nodes.
The LEXFAB-300:

- gives Elemental Concentration AND Thickness of thin professional films, layers or ULE implants.

- is designed for Product Wafer analysis (measurement area from 10µm to 100µm) including enhanced Pattern recognition.

- is fully compatible with SMIF 200mm, Open Cassette 200mm and FOUP 300mm standards. SECS/GEM automation.

- meets factory-required host communication protocols. Fully compliant with SEMI standards.

- provides Full Wafer Analysis and Mapping (concentration and thickness uniformity).

- is based on a Non-destructive technique.

- allows a high throughput.

- guarantees a high uptime, reliability and stability, ensuring documented long term tool matching.

- has an easy-to-use User Interface with dedicated recipes.