Measuring device for semiconductor industry
LEXFAB-300
CAMECA
Shallow Probe LEAXFAB-300
Semiconductor Fab Metrology Tool
Used for in-fab semiconductor metrology and R&D on thin films (from a few Å to several hundred nm). Based on a non-destructive technique, the Shallow Probe LEXFAB-300 provides elemental composition and thickness, dopant dosimetry, wafer mapping and micro-mapping. Main applications include SiON, shallow implants in Si, oxide/high-k stacks with or without metal, SiGe, B in SiGe, GST. Full in-line production capabilities: pattern recognition addressing 50 by 50µm pads, 300mm load ports, automated system based on SEMI standards, throughput varying from 4 to 8 wafers per hour.
Semiconductor Fab Metrology Tool
Used for in-fab semiconductor metrology and R&D on thin films (from a few Å to several hundred nm). Based on a non-destructive technique, the Shallow Probe LEXFAB-300 provides elemental composition and thickness, dopant dosimetry, wafer mapping and micro-mapping. Main applications include SiON, shallow implants in Si, oxide/high-k stacks with or without metal, SiGe, B in SiGe, GST. Full in-line production capabilities: pattern recognition addressing 50 by 50µm pads, 300mm load ports, automated system based on SEMI standards, throughput varying from 4 to 8 wafers per hour.
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