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CHO-BOND® adhesives are electrically conductive epoxy and silicone resins that cure at room temperature, elevated temperature or in humidity. CHO-BOND epoxies are two-part, silver-filled or silver-plated-copper-filled adhesives which cure at room or elevated temperatures into rigid structural bonds for attaching EMI vents, windows, mesh gaskets, or for filling cracks and seams. CHO-BOND conductive silicones contain silver-plated-copper. Their flexible nature in cured form is ideal for bonding conductive silicone gaskets in place.