Chomerics THERM-A-GAP™ 569, 570, 579 and 580 materials deliver improved thermal performance and conformability when compared to earlier gap fillers.
All materials come on an aluminum foil (A) or “clean break” glass (G) fiber carriers and can be permanently attached to cold surfaces thanks to the proven high strength acrylic pressure sensitive adhesive. These thermally conductive interface pads are intended for insertion between heat sinks and heat generating parts. G974 material has a thermal conductivity of 4.0 W/m-K and can mold to surface irregularities in order to fill the potential air gaps, enabling improved heat transmission.
The thickness of the available pads is from 0.010" to 0.060".