Z-axis interconnect technology, which is used to connect two parallel surfaces, is very important in demanding high-speed applications in the computer, telecommunications and aerospace markets. Cinch's Z-axis interconnect technology is solderless and utilizes compression style hardware to align and hold the components together. Cinch offers two connector technologies to meet the most challenging interconnect needs: CIN::APSE®, a unique wound contact and Cinch iQ™, a patented stamped contact.
