Dual-curing adhesive DELO DUALBOND

epoxyuniversalsingle-component

When it comes to certain applications, it is impossible to cure adhesives simply by exposing them to light. In addition, the dual curing mechanisms are beneficial, especially when bonding components with shadowed areas. The combination of light curing opportunities with reliable curing in shadowed areas is possible with an additional curing mechanism, included by heat or humidity, for example. • Good resistance to thermal shock • Fast light curing and reliable curing in shadowed areas • Universal adhesion to many substrates • Optimum flow behavior for sealing and casting • Transparent dual cure adhesives available for large bonding areas Please note: We supply hightech adhesives exclusively to manufacturing trades and industries. There is no direct sales to private customers as well as small and medium-sized enterprise (SME).