DELO-MONOPOX AC:
one-component, anisotropic electrically conductive adhesives,
heat-curing
DELO-MONOPOX:
one-component, non-conductive, heat-curing, reactive resins
Flip-chip bonding
The adhesive fulfils the task of the underfiller (no-flow underfilling) and of the contacting in one process step Fixing of SMD components
Tailor-made adhesive - DELO-MONOPOX MK096 - for fixing melves and glass SMD components
Properties:
DELO-MONOPOX AC:
enable production in the smart card and smart label industries to be noticeably rationalised by highly automated processes.
E.g., flip-chip technology: chip is set and contacted in one process step
DELO-MONOPOX:
extremely rapid curing
for flip-chip bonding and as Die Attach
Fixing of SMD components
Chip encapsulation compounds for the automotive sector and high-quality industrial products
Application areas:
Assembly
Smart card / Smart label
Micro-electronics
Automotive electronics
