Polyimide curing oven
max. 662°F (350°C) Despatch Industries

The PCO2-14™ Polyimide Cure solution is a clean process oven designed for polyimide baking, curing, and sterilizing applications. Many semiconductor manufacturing environments, front-end machines are adapted for polyimide curing. This costly process results in equipment typically not suitable for polyimide curing in terms of cleanliness, inert atmosphere capabilities, cycle time or data acquisition.

The PCO2-14™ optimizes the polyimide curing process for semiconductor wafer devices. It enables short cycle times and a consistent, reproducible cure process for all wafers in the product load by combining four essential characteristics in a single, compact design: clean process operation (Class 100 (ISO Class 5) recirculated airflow), inert atmosphere capabilities (<20 ppm of oxygen), temperatures up to 350°C, and fast cycle times with /- 1% temperature uniformity.

The oven's process monitoring system features a PC with Protocol Plus software to allow for communication between the PC and the oven, an Ethernet connection and a 15" flat panel display screen. The Protocol Plus™ software communicates directly with the oven's Protocol Plus™ controller, O2 controller, O2 monitor and integrated PC to observe and data log entire cycles and provide the user with real time information on set points, actual chamber temperatures and O2 levels throughout the entire process.