Acrylate adhesive
multi-componentdual-curingfor electronics

acrylate adhesive
acrylate adhesive
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Characteristics

Chemical composition
acrylate
Number of components
multi-component
Technical characteristics
dual-curing
Applications
for electronics, for printed circuit boards

Description

Dual-Cure electronic conformal coating and encapsulant technology represents the newest advancement in light/moisture cure technology. Dymax Dual-Cure conformal coatings and encapsulants for printed circuit boards (PCB) and electronics assembly applications are specifically formulated to ensure complete cure in applications where shadowed areas on high-density circuit boards are a concern. Previously, areas shadowed from light were managed by selective coating - eliminating the need to cure in shadowed areas or a secondary heat-cure process. Users needed to balance the cost of selective dispensing equipment and time/energy costs of a secondary heat cure. Dual-Cure conformal coating and encapsulating materials enable shadowed areas on PCBs to cure over time with moisture, eliminating the need for that second process step or concerns of component life degradation due to temperature exposure. In addition, Dymax Dual-Cure products fluoresce bright blue when exposed to UV light and are easily dispensed. Read more regarding dispensing equipment selection and setup considerations for Dual-Cure materials.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.