Encapsulation resin

encapsulation resin
encapsulation resin
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encapsulation

Description

UV Curing Resins for Electronic & Industrial Potting Applications DYMAX light cure UV potting materials cure tack free in seconds upon exposure to UV/Visible light. Each potting material is engineered to bond different substrates, offering tenacious adhesion to plastics and metals. DYMAX LED Protection potting materials are also available to enhance LED performance. UV potting resins reduce waste from off-ratio mixing and are free from isocyanates and heavy metals. Processing in seconds eliminates fixtures, jigs, racks, and ovens to increase space and lower total inventory costs. The materials are ideal for shallow potting and sealing of connectors, inductors, detectors, capacitors, RF circuits, relay screws, sensors, tamper proofing, and PCB encapsulation.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.