Tough, flexible UV light curing encapsulants cure in seconds and cut costs and processing times associated with microelectronic assembly. DYMAX 9000 Series encapsulating materials have high ionic purity, excellent adhesion, and resistance to humidity and thermal shock to effectively protect components. These encapsulants contain no sharp, abrasive mineral or glass fillers to abrade fine wires, and their combination of low Tg and low modulus means low stress. Ultraviolet light curing resins are ideal for glob top and chip on board applications and are especially suited for encapsulating IC's in flex circuits. Clear and black grades are available along with a wide range of viscosities, from thin wicking to non-flowing gel.
