Chip encapsulation compound DYMAX

DYMAX encapsulants cure in seconds upon exposure to UV and/or visible light to produce tough, flexible encapsulants for bare die, wire bonds, or integrated circuits (IC). The fast cure helps reduce processing and energy costs associated with alternative technologies. The materials are all one part, so no mixing is required and viscosity is consistent. DYMAX encapsulating materials have high ionic purity, resistance to humidity and thermal shock which effectively protect components. These encapsulants contain no sharp, abrasive mineral or glass fillers which may abrade fine wires. Their combination of low Tg and low modulus translates into low stress for bonded wires.
Ultraviolet light curing resins are ideal for glob top and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit or attaching it to glass or PCB. A wide range of viscosities, from thin wicking to non-flowing gel is available.

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