Diamond soft polishing pad
EHWA
Features
CMP Pad Conditioners are used for dressing poly-urethane based CMP pads. EHWA produces pad conditioners by three methods. BSL (brazed single layer) Electroplated. NEW BSL type (double metal layer).
Application
BSL products provide very fast removal rate as a result of the chemical bonding of the abrasive grit to a stainless steel body and the resuiting increased chip clearance. Electrolated products provide improved flatness and better surface finish.
The NEW BSL type has a double metal layer. The first layer provides excellent diamond retention and the second layer provides a clean surface that minimizes micro-scratches. The NEW BSL type conditioner combines the best features of both giving rapid stock remval while providing a clean surface that minimizes micro-scratches and provides improved flatness.
