Epoxy resin / encapsulation / thermal cycling / low-viscosity
thermal cycling, low-viscosity
ER2218 is a low viscosity, flame retardant, two part potting and encapsulating compound. The product has been specifically designed for compatibility with reflow applications, therefore remaining stable for short term, high temperature excursions. The system utilises a hardener free of DDM or other aromatic amines. The flame retardant filler used is a non-halogenated 'clean' type leading to relatively low toxicity fumes and low smoke emission.
Flame retardant, meets UL94 V-0
Excellent high temperature stability
Ideal for applications involving thermal cycling or extreme temperatures for short periods of time, such as reflow applications