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epoxy resin / encapsulation
ER2221 ELECTROLUBE

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epoxy resin / encapsulation epoxy resin / encapsulation - ER2221
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Characteristics

  • Type:

    epoxy

  • Applications:

    encapsulation

Description

Key Properties:

Two-part potting and encapsulating compound
Excellent thermal conductivity
Performs at high temperatures
Moderate viscosity for a filled system, provides thermal dissipation

Other ELECTROLUBE products

Potting Compounds