Epoxy resin / encapsulation / thermal cycling
ER2224 ELECTROLUBE

Characteristics

  • Type:

    epoxy

  • Applications:

    encapsulation

  • Other characteristics:

    thermal cycling

Description

ER2224 Epoxy potting compound is a highly thermally conductive resin (0.8 W/m*K) which also offers strong thermal cycling properties. It is an off-white resin allowing it to blend with LED designs, dissipating heat from the LED and extending the units operating lifetime and reliability while offering excellent environmental protection against the elements as well as showing good chemical resistance.

It has good high temperature stability with a wide operating temperature range which makes it suitable for a wide variety of applications.

Key Properties:
High thermal conductivity;
ideal for heat dissipation within LED applications
Good environmental protection;
offers good resistance to solvents and chemicals
Wide operating temperature range;
good high temperature stability
Very low water absorption
RoHS-2 Compliant

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