Transforming Thermal Management: CVD Diamond Heat Spreaders
Highest room temperature thermal conductivity of any material
CVD diamond’s thermal management properties address today’s single biggest cause of failure in electronics – heat.
Outperforms copper, silicon carbide and aluminum: by factors of 3-10
Heat spreaders with thermal conductivity levels from: 700-2000 W/mk.
Our expertise ensures ease of customer implementation
Using over 25 years of experience, Element Six helps customers integrate its free standing diamond heat spreaders into their modules and systems.
Range of thicknesses available: up to 3mm thick
Very flat and low roughness ensuring ease of attachment and minimized thermal interface resistances
Free-standing diamond available in large areas up to 140mm in diameter that can be laser cut to any required size
Metallization solutions enabling die bonding with low thermal barrier resistance, consistent with industry standard soldering and brazing
Electrically conductive ETC700 grade available, with or without metallization - for exceptional heat dissipation without impeding electrical performance
Extended device lifetimes for a given power level and increased performance and efficiency
Element Six’s CVD diamond heat spreaders enable the next generation of;
High Power RF Devices
High-Voltage Power Devices
Semiconductor Assembly & Test Equipment.