Lapping machine Engis

General description :

Specifically designed for unique polishing, delayering and planarization applications where R&D, prototype and small volume processing is required, Engis Microtech systems are available in both AM-15 benchtop and MPC floor-standing models. Each MPC system provides the kinematics and control required to develop processes that have 6-Sigma capability for material removal, flatness and surface finish generation. The menu-driven microprocessor control allows any polishing, delayering or planarization process to be fully optimized. The oscillation system provides 3-axis motion for true CMP kinematics.

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