Lead free electrically conductive adhesive
epotecny
To be compatible with Pb-free IC packages need to withstand a higher reflow temperature up to 260°C. for the smaller packages types. To achieve this, EPOTECNY has developped adhesives that have properties appropriate for these higher reflow temperature, with an excellent thermal stability and a low humidity uptake:
* Silver filled epoxy electro conductive adhesives
* Silver filled electro conductive varnishes
* Thermally conductive adhesives
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