Potting and encapsulation resin
epotecny
For encapsulation you will have choice among various epoxy resins:
* 1 or 2 components epoxy
* Heat curing from 25°C à 150°C ou UV curing
* Viscosities from 3 to 50 Pa.s
* Flexible or rigid
* Good ionic purity
* Low CTE
* Good adhesion on most substrates
Applications: Decoders, Smart cards, Semi-conductors, Hybrid circuits /PCB, Protection of electrical aplliances and electronics components,...
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