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Electronic: Semiconductor, Integrated Circuit, Circuit board...
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Die bonder
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Essemtec AG
Essemtec AG
Products
Catalogues
Exhibitor's key-words
Pick & place machine
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SMT pick & place machine
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Printer
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Brazing furnace
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Furnace
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Inspection device
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Handling system
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Dosing unit
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Dispenser
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Automatic storage system
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Die bonder
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Convection oven
Fully-automatic die bonder
FLX2011-CVD
Essemtec AG
FLX2011 dedicated for bare die bonding and SMD placement. Up to 8 tray stacker feeders can be installed (each holding 20 4x4" trays).
* Bare die and SMD placement
* 4x4" standard tray feeder
* Integrated dispenser
* High accuracy Vision
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28 Products
Essemtec AG
sorted by category
Machines for electronics production
Reflow soldering oven
RO-VARIO
Reflow soldering oven
RO300FC
Reflow soldering oven
RO06-PLUS
SMT pick & place machine
12 000 cph | FLX2021
Semi-automatic SMT pick and place machine
Expert
Forced convection reflow soldering oven
RO400FC
SMT pick & place machine
6 000 cph | FLX2011
SMT pick & place machine
4 500 cph | PANTERA X
SMT pick & place machine
6 000 cph | FLX2010-B
BGA pick & place machine
Pick & place machine for membrane keyboard
FLX2011-MK
Jet dispensing system
Scorpion
PCB handling system
Exhibitor's categories
Machines for electronics production
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Other manufacturing equipment
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Soldering machines, Brazing machines
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Automatic dispensers (liquids, resins)
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Automated storage
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NDT: Flaw detectors, Ultrasonic inspection devices...
standListOtherProduct www di En 2012-05-20-18
