The RO300FC exclusively heats with hot air convection and can be used for the different tasks in SMT assembly, especially for the reflow soldering of lead free solder pastes or the curing of adhesives. It features easy operation, perfect reflow results and a robust construction. It is well suited for continuous production, small batch manufacturing and prototyping. 100% convection heating Equal heating rates Minimum Delta-T Precise temperature control Soldering or curing applications Small dimensions – high throughput Volume or small series production Graphical recording of temperature profiles