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Reflow soldering oven
RO300FC Essemtec AG

The RO300FC exclusively heats with hot air convection and can be used for the different tasks in SMT assembly, especially for the reflow soldering of lead free solder pastes or the curing of adhesives. It features easy operation, perfect reflow results and a robust construction. It is well suited for continuous production, small batch manufacturing and prototyping.


100% convection heating
Equal heating rates
Minimum Delta-T
Precise temperature control
Soldering or curing applications
Small dimensions - high throughput
Volume or small series production
Graphical recording of temperature profiles
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