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Reflow soldering oven
RO-VARIO Essemtec AG

The RO-VARIO exclusively heats with hot air convection and can be used for the different tasks in SMT assembly, especially for the reflow soldering of lead free solder pastes or the curing of adhesives. The number and type of heating zones as well as the type of transport system is freely selectable. Therefore, the oven is configurable exactly according to the requirements.



100% convection heating
Equal heating rates
Minimum Delta-T
Precise temperature control
Soldering or curing applications
Six to twelve zones, freely selectable
Chain and/or mesh belt conveyor
Soldering width 600 mm (23.6“)
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