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Fully integrated assembly line for die and wire bonders

The 5th generation of F&K Delvotec's fine and heavy wire bonder systems offers utmost flexibility for all aluminium and gold wire applications from 17 to 600 µm. Optimum bond quality is ensured by the vibration-free machine frame and high performance bond heads with integrated impedance measurement and bond process control.

F&K Delvotec automation provides the advantage of an integrated process and quality control over multiple assembly stages. Our equipment shared platform concept of common hardware and software provides for powerful synergy gains, improved efficiency and lower costs for training, maintenance and spares management. F&K Delvotec offers complete line integration engineering. We can incorporate OEM curing ovens, plasma cleaners and test equipment to provide a single source for complete line automation.
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soc-pmea www di En 2008-07-30-25