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wire bonder

Semi-automatic wire bonder

Semi-Automatic Bonder and Bond Tester The 56xx universal machine closes the gap between the manual 53xx bonders and the fully automatic 6xxx bonders provided by the F&K Delvotec Group. Using a single machine base and exchangeable bond heads all bonding methods can be covered: Wedge wedge fine and heavy wire bonding, deep access bonding, ball wedge bonding and ribbon bonding. Furthermore, the bond results can be tested by exchanging the bond heads with one of the pull, shear, peel, or tweezer test heads.
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