Linear power amplifier Fairchild Semiconductor

General Description

The RMPA1766 Power Amplifier Module (PAM) is Fairchild's latest innovation in 50Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the call for ultra- low DC power consumption and extended battery life in portable electronics, the RMPA1766 uses novel proprietary circuitry to dramatically reduce amplifier current at low to medium RF output power levels (<+16dBm), where the handset most often operates. A simple two- state Vmode control is all that is needed to reduce operating current by more than 60% at 16dBm output power, and quiescent current (Iccq) by as much as 70% compared to traditional power- saving methods. No additional circuitry, such as DC- to- DC converters, are required to achieve this remarkable improvement in amplifier efficiency. Further, the 4 x 4 x 1.0 mm LCC package is pin- compatible and a drop- in replacement for last generation 4 x 4 mm PAMs widely used today, minimizing the design time to apply this performance- enhancing technology. The multi- stage GaAs Microwave Monolithic Integrated Circuit (MMIC) is manufactured using Fairchild HBT process.

Features

- 40% WCDMA efficiency at 28dBm Pout
- 20% WCDMA efficiency (58mA total current) at 16dBm Pout
- Low quiescent current (Iccq): 25mA in low-power mode
- Meets HSDPA performance requirements
- Single positive-supply operation with low power and shutdown modes
* 3.4V typical Vcc operation
* Low Vref (2.85V) compatible with advanced handset chipsets
- Compact Lead-free compliant LCC package - (4.0 x 4.0 x 1.0mm nominal)
- Industry standard pinout
- Internally matched to 50 Ohm and DC blocked RF input/output

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