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plastic cutting machine / infrared laser / wafer / CNC
QAC&BACL, LDC Farley Laserlab

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Characteristics

  • Material:

    for plastics

  • Technology:

    infrared laser

  • Product handled:

    wafer

  • Control type:

    CNC

  • X travel:

    250 mm

  • Y travel:

    250 mm

  • Cutting speed:

    Max.: 0.15 m/s (0.492 ft/s)

    Min.: 0.001 m/s (0.003 ft/s)

  • Laser power:

    20 W (0 hp)

Description

Features:
1. Fast speed
2. High processing quality
3. good beam quality
4. no mechanical stress
5. minimize the collapse and microcrack of chips
6. Low operating costs
7. 100, 000 hours average trouble-free operation
8. high electro-optic conversion efficiency
9. Powerful software with proprietary intellectual property rights
10. easy operation.

Parameters:
1. Laser Wavelength:1064nm
2. Laser Power:20W
3. Positioning Accuracy:±4μm
4. XY Grating Ruler Resolution:0.1μm
5. Z Axis Accuracy:±1μm
6. Rotation Axis Accuracy:±20″
7. Repeat Positioning Accuracy:±1μm
8. Working Table Route:250mm×250mm
9. Max Cutting Size:4 inches
10. Cutting Width:30-50μm
11. Cutting Depth:80-120μm
12. Cutting Speed:1-150mm/s

Application:
1. single-table glass inactive diode wafer

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