Fully-automatic ultrasonic flip chip die bonder
FINEPLACER® pico ama Finetech

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FINEPLACER® pico ama is a cost effective, fully-automated bonder, offering a high level of application flexibility. This award winning system is targeted for low volume production environments, as well as product and process development where flexibility is crucial.

Die bonder FINEPLACER® pico ama

Highlights

* Placement accuracy 5µm @ 3 sigma
* Component sizes from 0.15 x 0.15 mm² to 40 x 50 mm² *
* Working area up to 450 mm x 117 mm*
* Supports wafer/substrate sizes up to 8" *
* Supports bonding forces up to 50 N*
* Closed loop force control
* Fully automatic operation and assembly process
* Precise non-wearing xy planar table
* Traceability support with open data interface structure
* Flexible, cost effective performance