Manual die bonder
FINEPLACER® lambda
Finetech
The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key.
This cost-effective die bonder handles a wide range of sophisticated processes, including Indium bonding as well as extremely sensitive materials such as GaAs or GaP. Automated process modules are available.
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