Automatic pick-and-place machine placeALL®610XL

for LEDsfor BGASMT

The placeALL®610XL offers the largest space of the placeALL range. Its dimensions also enable the assembly of largest projects. Apart from the mere PC board surface there is enough space for numerous trays. Up to 346 different feeding positions can be provided. The available depth also allows the integration of an inline-system in the front area of the machine as well as lateral feeding units. Even in case of an inline function, there are still 262 feeding positions available as well as space for several trays. Assembling and dispensing of low and medium volume SMT up to 10500 (two heads) 6000 (4600 / IPC9850) components per hour. Feeding of components from tape, stick, tape stripe, tray and loose components. Chips 0201 up to Fine Pitch 70 × 70 mm and pitch 0.3 mm, BGAs, µBGAs, CSPs, QFNs and custom parts like connectors, wired THT-LEDs etc. The patented CyberOptics laser centering uses a laser diode to project a beam onto the component. By rotating the part and analyzing the resulting shadow length, the component is aligned. The centering mechanism is mounted directly to the assembly head and aligns the components when the head is moving from the pickup to the placement step. The laser centering can handle components from 0402 chips up to 22 × 22 mm (optional 32 x 32 mm) in size and 0.6 mm in pitch. With this system components up to 70 × 70 mm including pins (FP) and balls of BGAs can be measured using a camera picture. The software additionally checks, if the pins are straight respectively the balls are existent. These measures result in a higher output and a lower error rate.